Advanced ceramic technology for HDI and integrated packaging

Advanced Packaging

Volumn 8, Issue 3, 1999, Pages

  Horowitz, Samuel J ^a   Draudt, Richard R ^a   Amey, Daniel I ^a   Skurski, Michael A ^a   Smith, M A ^a  

^a DUPONT COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC MATERIALS; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT MANUFACTURE; LOW TEMPERATURE PROPERTIES; THICK FILMS;

ADVANCED PATTERNING TECHNOLOGY; HIGH DENSITY INTERCONNECT (HDI); LOW TEMPERATURE COFIRED CERAMIC MATERIALS;

CERAMIC MATERIALS;

EID: 0032644104     PISSN: 10650555     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (6)