Cooling solution for power amplifier modules in cellular phone applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 316-320

  Langari, Abdolreza ^a   Hashemi, Hassan ^a  

^a Rockwell Semiconductor Systems   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CELLULAR TELEPHONE SYSTEMS; CMOS INTEGRATED CIRCUITS; COOLING; HEAT PIPES; HEAT TRANSFER; POWER AMPLIFIERS; SEMICONDUCTING GALLIUM ARSENIDE; SEMICONDUCTING SILICON; TELEPHONE SETS; THERMOANALYSIS;

CELLULAR PHONES; GALLIUM ARSENIDE POWER AMPLIFIER; MICROHEAT PIPE;

MULTICHIP MODULES;

EID: 0032640846     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (10)