Thermoelectric properties of Pb1-xSnxTe FGM by liquid phase diffusion bonding

Materials Science Forum

Volumn 308-311, Issue , 1999, Pages 699-703

  Hashimoto, M ^a,d   Ohashi, O ^a   Shiota, I ^b   Kaibe, H T ^c   Nishida, I A ^d  

^a NIIGATA UNIVERSITY   (Japan)

^b KOGAKUIN UNIVERSITY   (Japan)

^c TOKYO METROPOLITAN UNIVERSITY   (Japan)

^d NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CARRIER CONCENTRATION; DIFFUSION; ELECTRIC RESISTANCE; INTERFACES (MATERIALS); PHASE COMPOSITION; STOICHIOMETRY; TEMPERATURE; THERMOELECTRICITY;

LEAD TIN TELLURIDE; LIQUID PHASE DIFFUSION BONDING;

SEMICONDUCTING LEAD COMPOUNDS;

EID: 0032639562     PISSN: 02555476     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (6)

1. I.A. Nishida, Materia Japan, JIM, Vol.35, No.9, (1996), p.943, in Japanese.
2. I.A. Nishida, "CRC Handbook of Thermoelectrics", ed. D.M. Rowe, CRC Press Inc., chap.15, (1995), p.157,
3. K. Uemura, and I.A. Nishida, "Thermoelectric Semiconductors and their applications", Nikkan-Kogyo Sinbunsya (1988), in Japanese.
4. S. Yoneda, H.T. Kaibe, T. Okumura, Y. Shinohara, Y. Imai, I.A. Nishida, T. Mochimaru, K. Takahashi, T. Noguchi and I. Shiota, Pro.4th Int. Symp. FGM (FGM'96), Tsukuba, (1996), p.575.
5. Y. Shinohara, Y. Imai, Y. Isoda, I.A. Nishida, H.T. Kaibe and I. Shiota, Pro. 16th Int. Conf. Thermoelectronics (ICT'97), Dresden (1997), p.387.
6. M. Hashimoto, I. Shiota, O. Ohashi, Y. Imai, Y. Isoda, Y. Shinohara and I.A. Nishida, Pro. 17th Int. Conf. Thermoelectronics (ICT'98), Nagoya, (1998), in printed.