Densification of W-Ni-Cu and W-Fe-Cu alloys at 1573 K

Journal of Materials Science and Technology

Volumn 15, Issue 1, 1999, Pages 94-96

  Xiong, Huaping ^a   Zhang, Lianmeng ^a   Shen, Qiang ^a   Yuan, Runzhang ^a  

^a WUHAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; COPPER ALLOYS; DENSIFICATION; HIGH PRESSURE ENGINEERING; HIGH TEMPERATURE PROPERTIES; IRON ALLOYS; NICKEL ALLOYS;

DYNAMIC HIGH PRESSURE TECHNOLOGY; FUNCTIONALLY GRADED MATERIALS;

TUNGSTEN ALLOYS;

EID: 0032639554     PISSN: 10050302     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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