Post-weld-shift in semiconductor laser packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 1159-1163

  Wang, S C ^a   Chang, H L ^a   Wang, C ^a   Wang, C M ^a   Liaw, J W ^a   Sheen, M T ^a   Kuang, J H ^a   Chien, C P ^a   Wang, G L ^a   Cheng, W H ^a  

^a CHUNGHWA TELECOM CO LTD   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; LASER BEAM EFFECTS; LASER BEAM WELDING; MATHEMATICAL MODELS; OPTOELECTRONIC DEVICES; SEMICONDUCTOR LASERS;

DUAL IN LINE PACKAGE; FIBER PIGTAIL; LASER PACKAGING; POST WELD SHIFT;

ELECTRONICS PACKAGING;

EID: 0032639426     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (12)