Grain boundary resistivity and electrically induced grain boundary migration (EIGM) in metallic bamboo microstructures

Interface Science

Volumn 7, Issue 1, 1999, Pages 33-44

  Dannenberg, Rand ^a   King, Alexander H ^a  

^a STONY BROOK UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CARRIER MOBILITY; COMPUTATIONAL METHODS; CRYSTAL ATOMIC STRUCTURE; CRYSTAL MICROSTRUCTURE; CURRENT DENSITY; ELECTROMIGRATION; ELECTRON SCATTERING; GRAIN BOUNDARIES; MATHEMATICAL MODELS; METALLIC FILMS; THERMAL CONDUCTIVITY OF SOLIDS;

ELECTRICALLY-INDUCED GRAIN BOUNDARY MIGRATION (EIGM); VOLUME EXPANSION;

GOLD;

EID: 0032637126     PISSN: 09277056     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1008778113938     Document Type: Article

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