Implementation and validation of a new thermal model for analysis design and characterization of multichip power electronics devices

IEEE Transactions on Industry Applications

Volumn 35, Issue 3, 1999, Pages 663-669

  Profumo, Francesco ^a  

^a POLITECNICO DI TORINO   (Italy)

Author keywords

Electrothermal model; Multichip; Power electronics; Simulation; Thermal impedance

Indexed keywords

COMPUTATIONAL METHODS; COMPUTER SIMULATION; ELECTRIC NETWORK ANALYSIS; ELECTRIC NETWORK SYNTHESIS; MULTICHIP MODULES; PARAMETER ESTIMATION; SEMICONDUCTOR DEVICE MODELS; SEMICONDUCTOR JUNCTIONS;

ELECTROTHERMAL MODELS; THERMAL IMPEDANCE;

POWER ELECTRONICS;

EID: 0032635907     PISSN: 00939994     EISSN: None     Source Type: Journal    
DOI: 10.1109/28.767018     Document Type: Article

References (11)

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