Ultra-thin electronic device package

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 657-662

  Chen, Kevin ^a   Zenner, Robert ^a   Arneson, Michael ^a   Mountain, David ^a  

^a 3M COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIES; FLIP CHIP DEVICES; INTEGRATED CIRCUITS; MULTICHIP MODULES; SILICON; SURFACES;

ADHESIVE FLIP CHIP TECHNOLOGY; MEMORY MODULES; NONPLANAR SURFACES; THIN FLEX CIRCUIT; THIN INTEGRATED CIRCUIT CHIPS; ULTRA THIN ELECTRONIC DEVICE PACKAGE;

ELECTRONICS PACKAGING;

EID: 0032633394     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (10)