Optical fiber sensors for studying drag forces of the molding flow in IC packaging

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3670, Issue , 1999, Pages 171-181

  Lo, Yu Lung ^a   Lai, Hsin Yi ^a   Tsai, Ming Hong ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; DRAG; ELECTRONICS PACKAGING; ENCAPSULATION; ETALONS; FINITE ELEMENT METHOD; INTEGRATED CIRCUIT MANUFACTURE; MATHEMATICAL MODELS; SEMICONDUCTOR DEVICE MANUFACTURE; STRAIN MEASUREMENT;

IN-LINE FIBER ETALONS (ILFE); TAKAISI MODEL;

FIBER OPTIC SENSORS;

EID: 0032631866     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (15)