Electrical and mechanical modeling of embedded capacitors

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 506-509

  Rao, Yang ^a   Qu, Jianmin ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; COMPUTER SIMULATION; COMPUTER SOFTWARE; ELECTRIC NETWORK ANALYSIS; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE;

ELECTRIC CROSSTALK; ELECTRICAL SIMULATION; EMBEDDED CAPACITOR; INTEGRAL PASSIVES; MULTICHIP MODULE; THERMAL MECHANICAL ANALYZE; THERMAL TOLERANCE;

CAPACITORS;

EID: 0032630128     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (9)