Underfill test methods for the harsh automotive environment

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Volumn 8, Issue 1, 1999, Pages

  Rosson, James M ^a   Clawson, Robert A ^a   Ihms, David W ^a  

^a Delphi Delco Electronics Systems   (India)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; AUTOMOTIVE ENGINEERING; ELASTIC MODULI; FLIP CHIP DEVICES; GLASS TRANSITION; TEMPERATURE;

COEFFICIENT OF THERMAL EXPANSION; FLIP CHIP ON BOARD TECHNOLOGY; GLASS SLIDE TEST; QUARTZ DIE TEST; UNDERFILL TEST METHODS;

PRINTED CIRCUIT TESTING;

EID: 0032629180     PISSN: 10650555     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (5)