SCOPUS 정보 검색 플랫폼

Volumn 34, Issue 3, 1999, Pages 461-468

Effect of stacking fault energy and strain rate on the microstructural evolution during room temperature tensile testing in Cu and Cu-Al dilute alloys

(2) Caballero, V a Varma, S K a

a University of Texas at El Paso (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITION REACTIONS; BAND STRUCTURE; COPPER; CRYSTAL MICROSTRUCTURE; DEFORMATION; ELECTRON ENERGY LEVELS; ELECTRON TRANSITIONS; GRAIN SIZE AND SHAPE; STACKING FAULTS; STRAIN RATE; TENSILE TESTING; TWINNING;

LOWER ENERGY CONFIGURATIONS; STACKING FAULT ENERGY;

COPPER ALLOYS;

EID: 0032629153 PISSN: 00222461 EISSN: None Source Type: Journal
DOI: 10.1023/A:1004526208389 Document Type: Article

Times cited : (24)

References (14)

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