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Volumn 82, Issue 6, 1999, Pages 1573-1575

Effect of grain contiguity on the thermal diffusivity of aluminum nitride

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM COMPOUNDS; CRYSTAL MICROSTRUCTURE; GRAIN SIZE AND SHAPE; SINTERING; THERMAL DIFFUSION IN SOLIDS;

ALUMINUM NITRIDE; THERMAL DIFFUSIVITY;

CERAMIC MATERIALS;

EID: 0032628249 PISSN: 00027820 EISSN: None Source Type: Journal
DOI: 10.1111/j.1151-2916.1999.tb01958.x Document Type: Article

Times cited : (24)

References (10)

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2
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3
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4
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- Development and microstructural characterization of high-thermal-conductivity aluminum nitride ceramics
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5
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- Ueno, F.¹

6
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- Effect of microstructure on thermal conductivity of AlN ceramics
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7
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- Thermodynamic and kinetic effects of oxygen removal on the thermal conductivity of aluminum nitride
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9
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10
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- (1998)
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.