Novel bonding technology for hermetically sealed silicon micropackage

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 38, Issue 1, 1999, Pages 1-6

  Lee, Duck Jung ^a   Ju, Byeong Kwon ^a   Choi, Woo Beom ^a   Jeong, Jee Won ^a   Lee, Yun Hi ^a   Jang, Jin ^b   Lee, Kwang Bae ^c   Myung Hwan, O H ^a  

^a Korea Institute of Science and Technology   (South Korea)

^b Kyung Hee University   (South Korea)

^c Sangji University   (South Korea)

Author keywords

Anodic bonding; Hermetic sealing; Hydrophilization; SDAB; SIMS analysis; Tensile strength

Indexed keywords

ELECTRIC POTENTIAL; ELECTRONICS PACKAGING; INTERFACES (MATERIALS); SCANNING ELECTRON MICROSCOPY; SECONDARY ION MASS SPECTROMETRY; SEMICONDUCTING GLASS; SEMICONDUCTING SILICON; SILICON WAFERS; SODIUM; TEMPERATURE; TENSILE STRENGTH;

ANODIC BONDING; HERMETIC SEALING; HYDROPHILIZATION; SILICON DIRECT BONDING;

BONDING;

EID: 0032625309     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.38.1     Document Type: Article

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