Heat dissipation in wearable computers aided by thermal coupling with the user

Mobile Networks and Applications

Volumn 4, Issue 1, 1999, Pages 3-13

  Starner, Thad ^a   Maguire, Yael ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT LOSSES; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS;

THERMAL COUPLING; WEARABLE COMPUTERS;

PERSONAL COMPUTERS;

EID: 0032623395     PISSN: 1383469X     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1019113924178     Document Type: Article

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