Thermal expansion measurement of pure aluminum using a very low thermal expansion heating stage for X-ray diffraction experiments

Review of Scientific Instruments

Volumn 70, Issue 8, 1999, Pages 3413-3417

  Langelaan, G ^a   Saimoto, S ^a  

^a QUEEN S UNIVERSITY   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; GRAIN SIZE AND SHAPE; HEATING; LATTICE CONSTANTS; TEMPERATURE MEASUREMENT; THERMAL EFFECTS; THERMAL EXPANSION; X RAY CRYSTALLOGRAPHY;

THERMAL EXPANSION COEFFICIENTS;

ALUMINUM;

EID: 0032615482     PISSN: 00346748     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1149928     Document Type: Article

References (11)

1. A.P. Clarke, S. Saimoto, and P. Ho, in AIP Conference Proceedings 305, Stress-Induced Phenomena in Metallization: 2nd International Workshop, edited by P.S. Ho, C.Y. Li, and P. Totta (AIP Press, New York, 1993), pp. 126-136.
2. G. Langelaan, M.Sc.Eng. thesis, Queen's University, 1997.
3. I.C. Noyan and J.B. Cohen, Residual Stress: Measurement by Diffraction and Interpretation (Springer, New York, 1987).
4. A.P. Clarke, Ph.D. thesis, Queen's University, 1993.
5. M.A. Korhonen and C.A. Paszkiet, Scr. Metall. 23, 1449 (1989).
6. P. van Houtte and L. de Buyser, Acta Metall. Mater. 41, 323 (1993).
7. P.M. Sutton, Phys. Rev. 91, 816 (1953).
8. A.J.C. Wilson, Proc. Phys. Soc. London 53, 517 (1941).
9. A.J. Cornish and J. Burke, J. Sci. Instrum. 42, 212 (1965).
10. W.B. Pearson, A Handbook of Lattice Spacings and Structures of Metals and Alloys (Pergamon, London, 1964).
11. Microcal Software, Inc., One Roundhouse Plaza, Northampton, MA 01060.