Soft-solution process of Fe–Tb–O films for use in high frequency micromagnetic devices

Journal of Applied Physics

Volumn 85, Issue 8, 1999, Pages 6007-6009

  Lim, Pang Boey ^a   Yamada, Koji ^a   Inoue, Mitsuteru ^b   Arai, Ken’ichi ^b   Izaki, Masanobu ^c   Fujii, Toshitaka ^d  

^a SAITAMA UNIVERSITY   (Japan)

^b TOHOKU UNIVERSITY   (Japan)

^c OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE   (Japan)

^d TOYOHASHI UNIVERSITY OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COERCIVE FORCE; COMPOSITION EFFECTS; ELECTRIC CURRENTS; ELECTRODEPOSITION; GRANULAR MATERIALS; IRON COMPOUNDS; MAGNETIC DEVICES; MAGNETIZATION; MATHEMATICAL MODELS; POTASSIUM COMPOUNDS; TERBIUM;

HETEROGRANULAR ALLOY FILMS; SOFT SOLUTION ELECTRODEPOSITION;

MAGNETIC FILMS;

EID: 0032614115     PISSN: 00218979     EISSN: 10897550     Source Type: Journal    
DOI: 10.1063/1.369064     Document Type: Conference Paper

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