CMP of polyimide for low-k dielectric application in ULSI

International Symposium on VLSI Technology, Systems, and Applications, Proceedings

Volumn , Issue , 1999, Pages 139-142

  Tai, Ya Li ^a   Dai, Bau Tong ^a   Tsai, Ming Shih ^a   Tung, I Chung ^a   Feng, Ming Shiann ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

AMMONIUM COMPOUNDS; CURRENT DENSITY; LSI CIRCUITS; PERMITTIVITY; POLYIMIDES; POTASSIUM; SILICA; SODIUM; STRESS ANALYSIS;

BIAS TEMPERATURE STRESS ANALYSIS; BIPHENYLDIAMINE PHENYLDIANHYDRIDE POLYIMIDE; CHEMICAL MECHANICAL POLISHING; TETRA METHYL AMMONIUM HYDROXIDE;

CHEMICAL POLISHING;

EID: 0032599233     PISSN: 1524766X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (8)