Energy capability of power devices with Cu layer integration

IEEE International Symposium on Power Semiconductor Devices and ICs (ISPSD)

Volumn , Issue , 1999, Pages 63-66

  Chung, Young S ^a   Willett, Terry ^a   Macary, Veronique ^a   Merchant, Steve ^a   Baird, Bob ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTRONICS PACKAGING; POWER ELECTRONICS; TEMPERATURE;

ENERGY CAPABILITY; POWER DEVICES;

MOSFET DEVICES;

EID: 0032598947     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (8)