Theoretical analysis of springback in bending of integrated circuit leadframes

Journal of Materials Processing Technology

Volumn 91, Issue 1, 1999, Pages 111-115

  Chan, K C ^a   Wang, S H ^a  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (FORMING); MATHEMATICAL MODELS; NUMERICAL ANALYSIS; PLASTIC DEFORMATION; QUALITY CONTROL; STRAIN HARDENING; STRESSES; STRIP METAL;

LEAD FRAMES; PLANE STRESS; SPRINGBACK;

INTEGRATED CIRCUIT LAYOUT;

EID: 0032598111     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-0136(98)00398-7     Document Type: Article

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