Study on the microwave curing of adhesive joints using a temperature-controlled feedback system

Journal of Materials Processing Technology

Volumn 91, Issue 1, 1999, Pages 128-149

  Yarlagadda, Prasad K D V ^a   Cheok, E C ^a  

^a QUEENSLAND UNIVERSITY OF TECHNOLOGY   (Australia)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE JOINTS; EPOXY RESINS; MECHANICAL PROPERTIES; MICROWAVE HEATING; TEMPERATURE CONTROL; THERMOMETERS;

INFRARED THERMOMETER; MICROWAVE CURING; TEMPERATURE CONTROLLED FEEDBACK SYSTEM;

CURING;

EID: 0032598103     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-0136(98)00436-1     Document Type: Article

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