Automation and fab concepts for 300 mm wafer manufacturing

Microelectronic Engineering

Volumn 45, Issue 2, 1999, Pages 91-100

  Binder, Harald ^a   Honold, Alfred ^b  

^a M+W Zander FE GmbH   (Germany)

^b Jenoptik Mikrotechnik   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMATION; CONTAMINATION; ENVIRONMENTAL PROTECTION; FABRICATION; PRODUCTION ENGINEERING; SEMICONDUCTING SILICON;

CONTAMINATION CONTROL; SILICON FABRICATION;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0032590883     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(99)00092-1     Document Type: Article

References (6)

1. Robertson F., Allan A. 300 mm Conversion Timing. Future Fab 3. 1997;Technology Publishing, London. p. 27.
2. Robertson F., Goodall R. Semiconductor industry 300 mm conversion business model. Proceedings of the Seventh International Symposium on Semiconductor Manufacturing (ISSM). 1998;53 Ultra Clean Society, Tokyo.
3. I300I Factory Guidelines Version 2.0, Technology Transfer #97063311 B-ENG, I300I, Austin, December 1997.
4. Eissler W., Schneider H. Experimental studies of minienvironment types. Proceedings of the 40th IES Annual Technical Meeting. 1:1994;396 Institute of Environmental Sciences, Mount Prospect.
5. Potti K. Survey of 300 mm wafer fab designs. Semiconductor Fabtech. 6:1996;101 I.C.G. Publishing, London.
6. 4 efficiency engineering. Semiconductor Fabtech. 8:1998;85 I.C.G. Publishing, London.