Si/SiO2 etching in high density SF6/CHF3/O2 plasma

Materials Science and Engineering B

Volumn 52, Issue 1, 1998, Pages 63-77

  Hsiao, R ^a   Carr, J ^a  

^a IBM ALMADEN RESEARCH CENTER   (United States)

Author keywords

Radio frequency induction plasma etcher; SF6 CHF3 O2; Si SiO2 etching

Indexed keywords

ATOMIC FORCE MICROSCOPY; PLASMA ETCHING; SEMICONDUCTING SILICON; SILICA; SULFUR COMPOUNDS;

HIGH DENSITY PLASMA ETCHERS; RADIO FREQUENCY INDUCTION PLASMA ETCHERS;

REACTIVE ION ETCHING;

EID: 0032489202     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5107(97)00217-1     Document Type: Article

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