Grain orientation effect on microstructure in tensile strained copper

Scripta Materialia

Volumn 38, Issue 11, 1998, Pages 1697-1703

  Huang, X ^a  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL ORIENTATION; DEFORMATION; ELECTRIC CONDUCTIVITY OF SOLIDS; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; METALLOGRAPHIC MICROSTRUCTURE; OPTICAL MICROSCOPY; RECRYSTALLIZATION (METALLURGY); SINGLE CRYSTALS; STRAIN; TENSILE TESTING; TWINNING;

COLD DRAWING; LINEAR INTERCEPT METHOD;

COPPER;

EID: 0032485632     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(98)00051-7     Document Type: Article

References (15)

1. X. Huang and N. Hansen, Scripta Mat. 37, 1 (1997).
2. X. Huang and N. Hansen, Submitted for publication.
3. J. W. Steeds, Proc. Roy. Soc. A292, 343 (1966).
4. Z. S. Basinski and S. Saimoto, Can. J. Phys. 45, 1161 (1967).
5. F. J. Humphreys and J. W. Martin, Phil Mag. 16, 927 (1967).
6. E. Gottler, Phil. Mag. 28, 1057 (1973).
7. Y. Kawasaki, Jpn. J. Appl. Phys. 18, 1429 (1979).
8. Y. Kawasaki and T. Takeuchi, Scripta Metall. 14, 183 (1980).
9. H. Mughrabi, T. Ungar, W. Kienle, and M. Wilkens, Phil. Mag. 53, 793 (1986).
10. Y. Kawasaki, in Strength of Materials, ed. K. Oikawa, K. Maruyama, S. Takeuchi, and M. Yamaguchi, p. 187, The Japan Institute of Metals (1990).
11. J. J. Gracio, J. V. Fernandes, and J. H. Schmitt, Mater. Sci. Eng. A. 118, 97 (1989).
12. H. Shankaranarayan and S. K. Varma, J. Mater. Sci. 30, 3576 (1995).
13. A. Borrego, Flow Stress of Polycrystalline Copper, Research Report, Risø (1997).
14. Q. Liu, Ultramicroscopy. 60, 81 (1995).
15. X. Huang and Q. Liu, Submitted for publication.