Comparison of TiN deposition by rf magnetron sputtering and electron beam sustained arc ion plating

Thin Solid Films

Volumn 334, Issue 1-2, 1998, Pages 173-177

  Xiao, Shiqin ^a   Lungu, Cristian P ^a,b   Takai, Osamu ^a  

^a NAGOYA UNIVERSITY   (Japan)

^b NATIONAL INSTITUTE FOR LASER   (Romania)

Author keywords

Ion plating; Sputtering; TiN

Indexed keywords

CHEMICAL BONDS; CRYSTAL STRUCTURE; ELECTRIC CONDUCTIVITY OF SOLIDS; LIGHT EMISSION; MAGNETRON SPUTTERING; SPUTTER DEPOSITION; TITANIUM COMPOUNDS; X RAY PHOTOELECTRON SPECTROSCOPY;

ARC ION PLATING;

SEMICONDUCTING FILMS;

EID: 0032483895     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(98)01138-9     Document Type: Article

References (7)

1. M. Sakaki, T. Sakakibara, IEEE Trans. Plasma Sci. 22 (1994) 1049.
2. G.I. Grigorov, I.N. Martev, M.V. Stoyanova, Thin Solid Films 198 (1991) 169.
3. I.G. Brown, X. Godechot, IEEE Trans. Plasma Sci. 19 (1991) 713.
4. P.J. Martin, R.P. Netterfield, J. Vac. Sci. Technol. A5 (1987) 22.
5. D.M. Sanders, D.B. Boercker, S. Falabella, IEEE Trans. Plasma Sci. 18 (1990) 883.
6. H. Kajioka, K. Higuchi, J. Vac. Sci. Technol. A 14 (1987) 3147.
7. D.D. Wang, T. Oki, Thin Solid Films 185 (1990) 219.