Exploring CMP solutions to planarity challenges with tungsten plugs

Thin Solid Films

Volumn 320, Issue 1, 1998, Pages 103-109

  Mendonca, John ^a   Murella, Krishna ^a   Kim, Inki ^a   Schlueter, Jim ^a   Karlsrud, Chris ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ETCHING; LITHOGRAPHY; SEMICONDUCTOR DEVICE MANUFACTURE; TUNGSTEN;

CHEMICAL MECHANICAL POLISHING; MULTI HEADED TOOLS; NON UNIFORMITY REDUCTION;

POLISHING;

EID: 0032482043     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(97)01076-6     Document Type: Article

References (0)