Effect of modulations on yield stress and strain hardening exponent of solution treated Cu-Ti alloys

Scripta Materialia

Volumn 38, Issue 9, 1998, Pages 1469-1474

  Nagarjuna, S ^a   Srinivas, M ^a   Balasubramanian, K ^b   Sarma, D S ^c  

^a DEFENCE METALLURGICAL RESEARCH LABORATORY   (India)

^b Non Ferrous Materials Technology Development Centre   (India)

^c BANARAS HINDU UNIVERSITY   (India)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTIVITY; FATIGUE OF MATERIALS; GRAIN SIZE AND SHAPE; HARDNESS; MECHANICAL PROPERTIES; MICROSTRUCTURE; QUENCHING; SOLUTIONS; STRAIN HARDENING; STRENGTH OF MATERIALS; TENSILE TESTING; YIELD STRESS;

SINGLE PHASE REGION; SOLUTION TREATMENT;

COPPER ALLOYS;

EID: 0032478362     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(98)00044-X     Document Type: Article

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