SCOPUS 정보 검색 플랫폼

Thin Solid Films

Volumn 332, Issue 1-2, 1998, Pages 319-324

A low temperature integrated aluminum metallization technology for ULSI devices

(6) Guo, Ted a Chen, Liang Y a Brown, Dirk b Besser, Paul b Voss, Steve a Mosely, Rod a

a APPLIED MATERIALS INC (United States)

b ADVANCED MICRO DEVICES (United States)

Author keywords

Aluminum; Chemical vapor deposition process; Integration; Metallization

Indexed keywords

ALUMINUM; ASPECT RATIO; ELECTRIC PROPERTIES; ELECTROMIGRATION; LOW TEMPERATURE PROPERTIES; METALLIZING; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SEMICONDUCTING FILMS; SEMICONDUCTOR DEVICE MANUFACTURE; THIN FILMS; ULSI CIRCUITS; VACUUM APPLICATIONS;

INTEGRATED ALUMINUM METALLIZATION PROCESS;

METALLIC FILMS;

EID: 0032476315 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/S0040-6090(98)01032-3 Document Type: Article

Times cited : (5)

References (14)

1
- 0344981984
- T. Guo, L.Y. Chen, M. Naik, Appl. Mater. HP PVD Update 4 (1) (1997) 6.
- (1997) Appl. Mater. HP PVD Update , vol.4 , Issue.1 , pp. 6
- Guo, T.¹ Chen, L.Y.² Naik, M.³

2
- 0346303392
- March/April
- T. Guo, et al., MRS Spring Meeting Symposium K, March/April, 1997.
- (1997) MRS Spring Meeting Symposium K
- Guo, T.¹

3
- 0040985662
- S. Vaidya, A.K. Sinha, Thin Solid Films 75 (1981) 252.
- (1981) Thin Solid Films , vol.75 , pp. 252
- Vaidya, S.¹ Sinha, A.K.²

4
- 84936699484
- Submicrometer Metallization
- D.B. Knorr, K.P. Rodbell, SPIE, Vol. 1805, Submicrometer Metallization, 1992, p. 210.
- (1992) SPIE , vol.1805 , pp. 210
- Knorr, D.B.¹ Rodbell, K.P.²

5
- 0022201344
- IEEE ed.
- T. Kwok, C.Y. Ting, J.-U. Han, Proc. 2nd Int. VLSI Multilevel Interconnection Conf., IEEE ed., 1985, p. 83.
- (1985) Proc. 2nd Int. VLSI Multilevel Interconnection Conf. , pp. 83
- Kwok, T.¹ Ting, C.Y.² Han, J.-U.³

6
- 0028728827
- D.D. Brown, M.A. Korhonen, P. Borgesen, C.-Y. Li, Mater. Res. Soc. Symp. Proc. 338 (1994) 435.
- (1994) Mater. Res. Soc. Symp. Proc. , vol.338 , pp. 435
- Brown, D.D.¹ Korhonen, M.A.² Borgesen, P.³ Li, C.-Y.⁴

7
- 0348194103
- T. Usui, T.D. Sullivan, T. Yanagisawa, R.G. Filippi, Proc. VMIC, 1996, p. 295.
- (1996) Proc. VMIC , pp. 295
- Usui, T.¹ Sullivan, T.D.² Yanagisawa, T.³ Filippi, R.G.⁴

8
- 0347564532
- Fall
- P.R. Besser, J.E. Sanchez, R. Alvis, Mater. Res. Soc. Symp. Proc., Fall 1994.
- (1994) Mater. Res. Soc. Symp. Proc.
- Besser, P.R.¹ Sanchez, J.E.² Alvis, R.³

9
- 0346303391
- Fall
- D.D. Brown, P.R. Besser, J.E. Sanchez Jr., M.A. Korhonen, C.-Y. Li, Mater. Res. Soc. Symp. Proc., Fall 1994.
- (1994) Mater. Res. Soc. Symp. Proc.
- Brown, D.D.¹ Besser, P.R.² Sanchez J.E., Jr.³ Korhonen, M.A.⁴ Li, C.-Y.⁵

10
- 0346933451
- Q-Z Hong, W-Y Hsu, L. Ting, G. Dixit, R. Havemann, Proc. VMIC 1996, p. 449.
- (1996) Proc. VMIC , pp. 449
- Hong, Q.-Z.¹ Hsu, W.-Y.² Ting, L.³ Dixit, G.⁴ Havemann, R.⁵

11
- 0001461308
- M. Danek, M. Liao, J. Tseng, et-al., Appl. Phys. Lett. 68 (1996) 1015.
- (1996) Appl. Phys. Lett. , vol.68 , pp. 1015
- Danek, M.¹ Liao, M.² Tseng, J.³

12
- 0346899985
- A.J. Konecni, G.A. Dixit, J.D. Luttmer, R.H. Havemann, M. Danek, M. Liao, Proc. VMIC, 1996, p. 181.
- (1996) Proc. VMIC , pp. 181
- Konecni, A.J.¹ Dixit, G.A.² Luttmer, J.D.³ Havemann, R.H.⁴ Danek, M.⁵ Liao, M.⁶

13
- 0346933454
- in press
- M. Avinun, W.D. Kaplan, M. Eizenberg, T. Guo, R. Mosely, Mater. Res. Soc. Eur. Symp. Proc (1998) in press.
- (1998) Mater. Res. Soc. Eur. Symp. Proc
- Avinun, M.¹ Kaplan, W.D.² Eizenberg, M.³ Guo, T.⁴ Mosely, R.⁵

14
- 0346933452
- M. Naik, L.Y. Chen, T. Guo, R. Mosely, I. Beinglass, F. Chen, Proc. VMIC, 1997, p. 383.
- (1997) Proc. VMIC , pp. 383
- Naik, M.¹ Chen, L.Y.² Guo, T.³ Mosely, R.⁴ Beinglass, I.⁵ Chen, F.⁶

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