Beryllium-copper reactivity in an ITER joining environment

Fusion Engineering and Design

Volumn 41, Issue 1-4, 1998, Pages 63-71

  Odegard Jr , B C ^a   Cadden, C H ^a   Yang, N Y C ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; BERYLLIUM; BOND STRENGTH (MATERIALS); COPPER; DIFFUSION; ELECTRODEPOSITION; EXPERIMENTAL REACTORS; INTERMETALLICS; PHASE INTERFACES; REACTIVITY (NUCLEAR); TENSILE TESTING; THERMAL EFFECTS;

INTERNATIONAL THERMONUCLEAR EXPERIMENTAL REACTORS (ITER); PLASMA FACING COMPONENTS (PFC); QUANTITATIVE MICROPROBE ANALYSIS;

TOKAMAK DEVICES;

EID: 0032475103     PISSN: 09203796     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0920-3796(98)00089-1     Document Type: Article

References (6)

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2. J.D. Baird, G.A. Geach, A.G. Knapton, K.B.C. West, Proc. 2nd United Nations Conf. Peaceful Uses of Atomic Energy, vol. 25, Geneva, Switzerland, 1958, pp. 328-333.
3. V.R. Barabash, L.S. Gitarsky, G.S. Ignakovskaya, Yu.G. Prokofiev, Beryllium-metal joints for applications in plasma-facing components, J. Nucl. Mater. (1994) 212-215.
4. H. Kawamura, M. Kato, Reactivity test between beryllium and copper, Proc. 2nd IEA Int. Workshop Beryllium Technology for Fusion, Jackson Lake Lodge, WY, September 6-8, 1995, pp. 204-211.
5. J.W. Dini, H.R. Johnson, Joining beryllium by plating, Paper presented at the 62nd Annu. Technical Conf. American Electroplating Society, Toronto, Canada, June 26-29, 1975, pp. 113-119.
6. D.L. Youchison, et al., Thermal fatigue testing of a diffusion-bonded beryllium divertor mock-up under ITER-relevant conditions, Fusion Technol. 29 (1996) 599-608.