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Volumn 186, Issue 3, 1998, Pages 362-368

The effects of argon gas flow rate and furnace pressure on oxygen concentration in Czochralski-grown silicon crystals

Author keywords

[No Author keywords available]

Indexed keywords

ARGON; CONTROL EQUIPMENT; OXYGEN; PRESSURE EFFECTS; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE MANUFACTURE; SURFACES; VELOCITY;

EID: 0032473196     PISSN: 00220248     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0022-0248(97)00491-0     Document Type: Article
Times cited : (57)

References (12)
  • 3
    • 0002697365 scopus 로고
    • H.R. Huff et al. (Eds.), The Electrochemical Society
    • J.W. Moody, in: H.R. Huff et al. (Eds.), Semiconductor Silicon 1986, The Electrochemical Society, 1986, p. 100.
    • (1986) Semiconductor Silicon 1986 , pp. 100
    • Moody, J.W.1
  • 4
    • 0342604325 scopus 로고
    • D.C. Gupta (Ed.), American Society for Testing and Materials
    • W. Lin, D. Hill, in: D.C. Gupta (Ed.), Silicon Processing, ASTM STP 804, American Society for Testing and Materials, 1983, pp. 24-38.
    • (1983) Silicon Processing, ASTM STP 804 , pp. 24-38
    • Lin, W.1    Hill, D.2
  • 6
    • 0003143598 scopus 로고
    • H.R. Huff et al. (Eds.), The Electrochemical Society
    • W. Zulehner, in: H.R. Huff et al. (Eds.), Semiconductor Silicon 1990, The Electrochemical Society, 1990, p. 30.
    • (1990) Semiconductor Silicon 1990 , pp. 30
    • Zulehner, W.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.