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Volumn 135, Issue 1-4, 1998, Pages 545-549

Adhesion modification in (Cu, Nb, Ti)/SiO2 pairs by argon ion bombardment

Author keywords

Adhesion modification; Interface; Ion bombardment; Metal oxide pairs

Indexed keywords

ADHESION; ARGON; COPPER; INTERFACES (MATERIALS); ION BEAMS; METALLIC FILMS; NIOBIUM; NUCLEAR ENERGY; SILICA; TITANIUM;

EID: 0032472630     PISSN: 0168583X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0168-583X(97)00627-7     Document Type: Article
Times cited : (4)

References (10)
  • 1
    • 0001960254 scopus 로고
    • Interface design for thin film adhesion
    • Lieng-Huang Lee (Ed.), Plenum Press, New York
    • J.E.E. Baglin, Interface design for thin film adhesion, in: Lieng-Huang Lee (Ed.), Fundamentals Of Adhesion, Plenum Press, New York, 1991, p. 379.
    • (1991) Fundamentals of Adhesion , pp. 379
    • Baglin, J.E.E.1
  • 2
    • 0345817006 scopus 로고
    • Interface structure, adhesion, and ion beam processing
    • Y. Pauleau (Ed.), Kluwer Academic Publishers, Dordrecht, The Netherlands
    • J.E.E. Baglin, Interface structure, adhesion, and ion beam processing, in: Y. Pauleau (Ed.), Materials and Processes For Surface Engineering, Kluwer Academic Publishers, Dordrecht, The Netherlands, 1995, p. 142.
    • (1995) Materials and Processes for Surface Engineering , pp. 142
    • Baglin, J.E.E.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.