Long linear MWIR and LWIR HgCdTe infrared detection arrays for high resolution imaging

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3553, Issue , 1998, Pages 23-32

  Chamonal, Jean Paul ^a   Audebert, Patrick ^a   Medina, Philippe ^a   Destefanis, Gérard ^a   Deschamps, Joël ^a   Girard, Michel ^a   Chatard, Jean Pierre ^a  

^a CEA LETI   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; ELECTROOPTICAL DEVICES; IMAGING SYSTEMS; INFRARED IMAGING; INTEGRATED CIRCUIT MANUFACTURE; INTEGRATED OPTOELECTRONICS; MERCURY COMPOUNDS; PHOTOVOLTAIC EFFECTS; SCANNING; SILICON WAFERS;

HIGH RESOLUTION INFRARED IMAGING SYSTEMS; INFRARED DETECTION ARRAYS; MERCURY CADMIUM TELLURIDE; READOUT INTEGRATED CIRCUITS; VERY LONG SCANNING ARRAYS;

INFRARED DETECTORS;

EID: 0032404974     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.318092     Document Type: Conference Paper

References (5)

1. JP. Chamonal, C. Lucas, P. Bouchut, D. Blachier, P. Angebault, "Recent developments on 12.5 μm infrared detection buttable linear arrays", Proceedings of SPIE Conf. Orlando 1992, Vol. 1685, pp. 205-212.
2. R. Davancens, A. Meynardi, LP. Angebault, JP. Chamonal, "Development of a long linear array beyond 12.5 μm for Earth observation", Proceedings of SPIE Conf. San Diego 1995, Vol. 2552, pp. 853-864.
3. JP. Chamonal, P. Audebert, G. Destéfanis, P. Médina, M. Ravetto, J. Deschamps, M. Girard, JP. Chatard, "Long MWIR HgCdTe butted linear arrays", Proceedings of SPIE Conf. Orlando 1997, Vol. 3061 (II), pp. 467-475.
4. JL. Tissot, F. Marion, "Collective flip-chip technology for HgCdTe IRFPA", Photonics China 1996, SPIE Proceedings Vol. 2894.
5. F. Marion, M. Ravetto, JP. Chamonal, C. Cigna, "New optoelectronic multichip module for infrared: module design and flip chip hybridization requirements" Conf. San José 1994, ITAP & Flip Chip Proceedings, pp. 29-31.