Technique to analyze large area surface roughness of a wafer using TXRF

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3509, Issue , 1998, Pages 228-234

  Noack, Brooke ^a   Hossain, Tim Z ^a  

^a ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; CONTAMINATION; FLUORESCENCE; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS; SURFACE ROUGHNESS;

MICROAREA; TOTAL REFLECTION X RAY FLUORESCENCE;

MICROELECTRONIC PROCESSING;

EID: 0032404575     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.324416     Document Type: Conference Paper

References (3)

1. R. Howland, and L. Benatar, A Practical Guide to Scanning Probe Microscopy, pp. 5-13, Park Scientific Instruments, Sunnyvale, CA, 1996.
2. R. Klockenkäper, Total-Reflection X-Ray Fluorescence Analysis, John Wiley & Sons Inc, New York, 1997.
3. L.A. Files, T. Orent, M. Hammerbacher, J. Arch, and J. Butterbaugh, "Total Reflection X-Ray Fluorescence Spectroscopy: Analysis of Semiconductor Materials", Proceedings of the Electrochemical Society on Diagnostic Techniques for Semiconductor Materials and Devices, D.K. Schroder, J.L Benton, and P. Rai-Choudhury, Volume 9433, pp. 322-337, The Electrochemistry Society, Pennington, NJ, 1994.