Finite-element analysis of thermal stresses in laser packaging

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3419, Issue , 1998, Pages 93-101

  Sheen, Maw Tyan ^a   Chen, Cheng Huang ^a   Kuang, Jao Hwa ^a   Cheng, Wood Hi ^a   Chang, Huang Lon ^a   Wang, Szu Chun ^a   Wang, Chungyung ^a   Wang, Chy Ming ^a   Liaw, Jy Wang ^a  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

Author keywords

Crack; Finite element method; Laser packaging; Thermal stress

Indexed keywords

CRACK INITIATION; FINITE ELEMENT METHOD; SEGREGATION (METALLOGRAPHY); SHRINKAGE; SOLIDIFICATION; TENSILE STRESS; THERMAL STRESS;

LASER PACKAGING;

LASER BEAM WELDING;

EID: 0032402881     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.310995     Document Type: Conference Paper

References (10)

1. Intergranular embrittlement of laser welds by gold segregation
2. Optical components-the new challenge in packaging
3. Defect formation mechanisms in laser welding technique for semiconductor laser packaging
4. Direct evidence of Au segregation in laser welded Au-coated Invar material
5. Defects in optoelectronic materials due to Phosphorus-containing underlayer
6. Effect of Au thickness on laser beam penetration in semiconductor laser packages