Development of high-speed 3D inspection system for solder bumps

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3306, Issue , 1998, Pages 60-67

  Nishiyama, Y ^a   Tsukahara, H ^a   Oshima, Y ^a   Takahashi, F ^a   Fuse, T ^a   Nishino, T ^a  

^a FUJITSU LABORATORIES LTD   (Japan)

Author keywords

3D inspection; Acousto optical deflector; Cylindrical lensing effect; Flip chip bonding; Solder bump

Indexed keywords

ACOUSTOOPTICAL DEVICES; FLIP CHIP DEVICES; LASER BEAMS; LSI CIRCUITS; SCANNING; SEMICONDUCTOR LASERS;

SOLDER BUMPS;

OPTICAL SYSTEMS;

EID: 0032400704     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.301246     Document Type: Conference Paper

References (6)

1. Fluxless solder technology with vapor phase soldering in nitrogen
2. Solder bump transcription technology using a dimple-plate method
3. High-speed 3-D inspection system for solder bumps
4. Basics of acousto-optic devices
5. Optical considerations for an acoustooptic deflector
6. High speed laser beam scanning using an acousto-optical deflector (AOD)