Deposition rate dependence of step coverage of sputter deposited aluminums 1.5% copper films

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 16, Issue 5, 1998, Pages 3123-3126

  Taylor, Donald S ^a,c   Jain, Manoj K ^b,d   Cale, Timothy S ^b  

^a MOTOROLA INC   (United States)

^b ARIZONA STATE UNIVERSITY   (United States)

^c MOTOROLA INC   (United States)

^d TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0032394147     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.581476     Document Type: Article

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