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Volumn 335, Issue 1-2, 1998, Pages 122-126

Modeling of reactively sputtered TiAlN films

Author keywords

Alloys; Aluminum; Auger electron spectroscopy; Physical vapor deposition

Indexed keywords

AUGER ELECTRON SPECTROSCOPY; COMPUTER SIMULATION; REACTION KINETICS; SPUTTERING; STEEL; STOICHIOMETRY; SUBSTRATES; TITANIUM ALLOYS; VAPOR DEPOSITION;

EID: 0032320114     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(98)00969-9     Document Type: Article
Times cited : (11)

References (25)
  • 19
    • 0347594602 scopus 로고
    • R.F. Bunshan (ed.), Noyes Publications, Park Ridge, NJ, Chapter 3
    • D.M. Mattox, in: R.F. Bunshan (ed.), Deposition Technologies for Films and Coatings, Noyes Publications, Park Ridge, NJ, 1982, Chapter 3, pp. 183-186.
    • (1982) Deposition Technologies for Films and Coatings , pp. 183-186
    • Mattox, D.M.1
  • 23
    • 0003666038 scopus 로고
    • S.M. Rossnagel, J.J. Cuomo, W.D. Westwood (Eds,), Noyes Publications, Park Ridge, NJ, Chapter 9
    • W.D. Westwood, in: S.M. Rossnagel, J.J. Cuomo, W.D. Westwood (Eds,), Handbook of Plasma Processing Technology, Noyes Publications, Park Ridge, NJ, 1989, Chapter 9.
    • (1989) Handbook of Plasma Processing Technology
    • Westwood, W.D.1
  • 25
    • 35848953179 scopus 로고
    • American Chemical Society, American Institute of Physics for National Institute of Standards Technology
    • JANAF Thermochemical Tables, 3rd ed., American Chemical Society, American Institute of Physics for National Institute of Standards Technology, 1985.
    • (1985) JANAF Thermochemical Tables, 3rd Ed.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.