Modeling of failure time distributions for interconnects due to stress voiding and electromigration

Materials Research Society Symposium - Proceedings

Volumn 516, Issue , 1998, Pages 147-158

  Wolfer, W O ^a   Bartelt, M C ^a   Dike, J J ^a   Hoyt, J J ^a   Gleixner, R J ^a   Nix, W D ^a  

^a LAWRENCE LIVERMORE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMIGRATION; FAILURE ANALYSIS; FUNCTIONS; MASS TRANSFER; STRESS ANALYSIS;

ELASTIC RESPONSE FUNCTIONS; GENERALIZED KORHONEN EQUATION;

SEMICONDUCTOR DEVICE MODELS;

EID: 0032318299     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)