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Volumn 21, Issue 1 -4 pt 1, 1998, Pages 115-126
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Optimization of plastic packaging of ferroelectric semiconductor memories
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Author keywords
[No Author keywords available]
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Indexed keywords
CURING;
FERROELECTRIC DEVICES;
PLASTIC FLOW;
PLASTIC PRODUCTS;
PLASTICS MOLDING;
THERMAL EFFECTS;
FERROELECTRIC SEMICONDUCTOR MEMORY;
SEMICONDUCTOR STORAGE;
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EID: 0032316854
PISSN: 10584587
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1080/10584589808202056 Document Type: Article |
Times cited : (1)
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References (5)
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