Reduction of residual stress for ZnO/Al thin films on glass substrate prepared by radio frequency magnetron sputtering

Vacuum

Volumn 51, Issue 4, 1998, Pages 677-681

  Sakaguchi, K ^a   Iwasa, S ^a   Yoshino, Y ^b  

^a Kanazawa Murata Mfg Co Ltd   (Japan)

^b MURATA MANUFACTURING CO LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; COMPRESSIVE STRESS; CRACKS; CRYSTAL LATTICES; FINITE ELEMENT METHOD; GLASS; MAGNETRON SPUTTERING; RESIDUAL STRESSES; SPUTTER DEPOSITION; TENSILE STRESS; X RAY CRYSTALLOGRAPHY; ZINC OXIDE;

INTERDIGITAL TRANSDUCERS;

THIN FILMS;

EID: 0032316795     PISSN: 0042207X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0042-207X(98)00273-5     Document Type: Article

References (7)

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3. Foster, N. F., J. Vac. Sci. Technol., 1969, 6, 111.
4. Hada, T., Wasa, K. and Hayakawa, S., Thin Solid Films, 1971, 7, 135.
5. Bland, R. D., Komimiak, G. J. and Mattox, D. M., J. Vac. Sci. Technol., 1974, 11, 671.
6. Wu, C. T., Thin Solid Films, 1979, 64, 103.
7. Larson, J. D., Winslow, D. K. and Zitelli, L. T., IEEE Trans. Son. and Ultrason., January (1972) 18-22.