Novel facing targets sputtering apparatus with uniform magnetic field and plasma-free substrates

Vacuum

Volumn 51, Issue 4, 1998, Pages 687-690

  Noda, Kohki ^a   Hirata, Toyoaki ^b   Kawanabe, Takashi ^a   Naoe, Masahiko ^c  

^a IBM JAPAN LTD   (Japan)

^b Thin Film Process Soft   (Japan)

^c TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM ALLOYS; IRON ALLOYS; MAGNETIC FIELD EFFECTS; MAGNETIC FILM STORAGE; MAGNETIC RECORDING; MAGNETS; PLASMA CONFINEMENT; PLASMA DENSITY; THIN FILMS; VOLTAGE MEASUREMENT;

FACING TARGETS SPUTTERING (FTS);

SPUTTERING;

EID: 0032316671     PISSN: 0042207X     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0042-207x(98)00275-9     Document Type: Article

References (4)

1. Nakagawa, S., Niimura, Y., Naoe, M. and Hoshi, Y., IEICE Technical Report. 1985, CPM 85-114, 53.
2. Kadokura, S., Naoe, M. and Honjo, K., IEICE J., 1991, J74 C-2, 642.
3. Report of the Trust Research of JRDC. 1994.
4. Noda, K., Kawanabe, T. and Naoe, M., AIP J. Appl. Phys., 1997, 81(8), 3955.