Electromigration damage in aluminum alloys studied by 1/f noise

Materials Research Society Symposium - Proceedings

Volumn 516, Issue , 1998, Pages 3-8

  Kruelle, C A ^a   Ochs, E ^a   Stoll, H ^a   Seeger, A ^a   Bloom, I ^a  

^a MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; COPPER; CRYSTAL MICROSTRUCTURE; CURRENT DENSITY; DIFFUSION IN SOLIDS; ELECTRIC RESISTANCE; ELECTROMIGRATION; FUNCTIONS; GRAIN BOUNDARIES; POLYCRYSTALLINE MATERIALS; SIGNAL NOISE MEASUREMENT;

DISTRIBUTION FUNCTIONS;

SEMICONDUCTING ALUMINUM COMPOUNDS;

EID: 0032315941     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-516-3     Document Type: Conference Paper

References (15)