Chip size package - the option of choice for miniaturized medical devices

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3582, Issue , 1998, Pages 749-754

  Toepper, M ^a   Schaldach, M ^a   Fehlberg, S ^a   Karduck, C ^a   Meinherz, C ^a   Heinricht, K ^a   Bader, V ^a   Hoster, L ^a   Coskina, P ^a   Kloeser, A ^a   Ehrmann, O ^a   Reichl, H ^a  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT LAYOUT; MICROPROCESSOR CHIPS; MULTICHIP MODULES; PRODUCT DEVELOPMENT; SILICON WAFERS; THIN FILMS;

CHIP SCALE PACKAGES (CSP); WAFERLEVEL THIN FILM REDISTRIBUTION PROCESSES;

MICROELECTRONICS;

EID: 0032315653     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)