Building of silicon mechanical sensors by bulk micromachining and anodic bonding

Proceedings of the International Semiconductor Conference, CAS

Volumn 1, Issue , 1998, Pages 33-44

  Lapadatu, Daniel ^a   Jakobsen, Henrik ^a  

^a SensoNor asa ^*  (Norway)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; MICROMACHINING; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE MANUFACTURE;

ANODIC BONDING;

MICROSENSORS;

EID: 0032314872     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (54)