3-D interconnected porous AlN composite: a viable substrate for electronic packaging

National Aerospace and Electronics Conference, Proceedings of the IEEE

Volumn , Issue , 1998, Pages 656-665

  Kim, Jin Yong ^a   Kumta, Prashant N ^a  

^a CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; COMPOSITE MATERIALS; PERMITTIVITY; POROUS MATERIALS; POWDERS; SEMICONDUCTING ALUMINUM COMPOUNDS; SUBSTRATES; THERMAL CONDUCTIVITY;

BOROPHOSPHOSILICATE GLASS; CERAMIC PROCESSING METHOD;

ELECTRONICS PACKAGING;

EID: 0032314701     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (28)