Application of a 'surrogate' layer for lower bending stress in a vulnerable material of a tri-material body

Microelectronics Reliability

Volumn 38, Issue 12, 1998, Pages 1949-1954

  Suhir, E ^a   Weld, J D ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; COMPOSITE MATERIALS; ELASTIC MODULI; EPOXY RESINS; STRESS ANALYSIS; SUBSTRATES; TENSILE STRESS; THERMAL EXPANSION;

BENDING STRESS; THERMAL EXPANSION COEFFICIENT;

ELECTRONICS PACKAGING;

EID: 0032314674     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(98)00155-3     Document Type: Article

References (2)

1. Suhir E, Weld JD. Electronic package with reduced bending stress. U.S. Patent 5,627,407, 1997.
2. Suhir E. Calculated thermally induced stresses in adhesively bonded and soldered assemblies. In: Proceedings of the International Symposium on Microelectronics. ISHM, Atlanta, GA, 1986.