Thin film mechanical properties through nano-indentation

Materials Research Society Symposium - Proceedings

Volumn 522, Issue , 1998, Pages 317-321

  Adhihetty, Indira ^a   Hay, Jennifer ^a   Chen, Wei ^a   Padmanabhan, Paddy ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ELASTIC MODULI; HARDNESS; MATERIALS TESTING APPARATUS; NANOTECHNOLOGY; THIN FILMS;

ADHESION TESTER; DYNAMIC MECHANICAL ANALYSIS; NANOINDENTATION;

PLASTIC FILMS;

EID: 0032313914     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)