Kinetics of splitting in the Smart-Cut process

IEEE International SOI Conference

Volumn , Issue , 1998, Pages 137-138

  Aspar, B ^a   Lagahe, C ^a   Moriceau, H ^a   Soubie, A ^a   Bruel, M ^a   Auberton Herve, A J ^a   Barge, T ^a   Maleville, C ^a  

^a CEA GRENOBLE   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; ANNEALING; BONDING; DELAMINATION; ION IMPLANTATION; PROTONS; REACTION KINETICS; SILICON WAFERS; SUBSTRATES;

PROTON IMPLANTATION; WAFER BONDING;

SILICON ON INSULATOR TECHNOLOGY;

EID: 0032313801     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)