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Volumn 3582, Issue , 1998, Pages 144-149
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Ceramic design and reliability issues in assembly of RF/microwave power packages
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Author keywords
[No Author keywords available]
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Indexed keywords
BENDING STRENGTH;
CERAMIC MATERIALS;
ELECTRIC INSULATORS;
FAILURE ANALYSIS;
FINITE ELEMENT METHOD;
INSPECTION;
MICROWAVE DEVICES;
PROBABILITY;
RELIABILITY;
WEIBULL DISTRIBUTION;
CERAMIC INSULATOR MATERIAL;
FAILURE PROBABILITIES;
ELECTRONICS PACKAGING;
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EID: 0032312689
PISSN: 0277786X
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (2)
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References (2)
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