A computer experiment to determine the impregnability of mica tape based insulation

IEEE Transactions on Dielectrics and Electrical Insulation

Volumn 5, Issue 6, 1998, Pages 886-891

  Velten, K ^a   Schattauer, D ^b  

^a FRAUNHOFER INSTITUTE FOR INDUSTRIAL MATHEMATICS ITWM   (Germany)

^b SIEMENS AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; IMPREGNATION; MICA; POROUS MATERIALS; THERMAL EFFECTS;

DARCY POROUS MEDIA FLOW EQUATIONS;

ELECTRIC INSULATING MATERIALS;

EID: 0032310174     PISSN: 10709878     EISSN: None     Source Type: Journal    
DOI: 10.1109/94.740771     Document Type: Article

References (8)

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2. S. G. Advani, M. V. Bruschke and R. D. Parnas, "Resin Transfer Molding Flow Phenomena in Polymeric Composites", in Flow and Rheology in Polymer Composites Manufacturing, S. G. Advani, Ed., pp. 465-515, Elsevier Science, Amsterdam, 1994.
3. R. Gauvin and F. Trochu, "Comparison between Numerical and Experimental Results for Mold Filling in Resin Transfer Molding", Plastics, Rubber and Composites Processing and Applications, Vol. 19, pp. 151-157, 1993.
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5. M. V. Bruschke, and S. G. Advani, "A Numerical Approach to Model Non-Isothermal Viscous Flow through Fibrous Media with Free Surfaces", Int. J. Numer. Meth. Fluids, Vol. 19, pp. 575-603, 1994.
6. C. W. Hirt and B. D. Nichols, "Volume of Fluid (VOF) Method for the Dynamics of Free Boundaries", J. Comput. Phys., Vol. 39, pp. 201-225, 1981.
7. J. B. Flynn, "Impregnation Study of Porous Elements of High Voltage Components", IEEE Trans. Electr. Insul., Vol. 20, pp. 625-627, 1985.
8. K. Velten, "Quantitative Analysis of the Resin Transfer Molding Process", Journal of Composite Materials, Vol. 32 (20), pp. 1865-1892, 1998.